مشروع |
وصف المنتج |
نوع المنتج |
Strip-shaped solder pad, frame and substrate-type solder wire products |
بنود التفتيش |
Die shedding, offset, die reversed, error, silver paste/foreign object, contamination, scratch, chipping, broken edge, die crack, insufficient silver paste, miss wire, ball shedding,abnormal ball, ball offset, 2nd bonding shedding, 2nd bonding offset, 2nd bonding abnormal, broken wire, wire bending, tail length, foreign object |
UPH |
40-80strips/H(Determined by the size of the material strip and the size of the die) |
دقة |
5 ميكرومتر/بكسل |
جميع الحقوق محفوظة لشركة Guangzhou Minder-Hightech Co.,Ltd.