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Video
- MH Company Video
- Semiconductor Device Fabrication
- IC/TO Package Video
- Vacuum Pack System
- Plasma Surface Treatments Video
- Winding machine
- Ultrasonic Welder
- Grinder and Polisher Video
- Soldering Dispensing Screwing Robots
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Automatic wire bonder for IC TO package
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Die bonder draw line: X, O, +, *, choosing arbitrarily on the program.
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Customer training Die Bonder usage in China
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High precision die bonder use for high requirment die bonding
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MDB-7550 Manual Heavy Wire Wedge Bonder
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Semiconductor packaging equipment / Die bonder / Die bonding machine
