Proyekto |
Nilalaman |
Uri ng Produkto |
Strip-shape na solder pad, frame at substrate-type na solder wire products |
Mga Item ng Pagsusuri |
Nagbubukas na die, offset, binaling die, error, silver paste/ibang bagay, kontaminasyon, sugat, chipping, broken edge, die crack, kakaunti lang na silver paste, miss wire, ball shedding, abnormal ball, ball offset, 2nd bonding shedding, 2nd bonding offset, 2nd bonding abnormal, broken wire, wire bending, tail length, ibang bagay |
UPH |
40-80strips/H(Tinutukoy sa pamamagitan ng laki ng material strip at sa laki ng die) |
Katumpakan |
5μm/pixel |
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