Guangzhou Minder-Hightech Co.,Ltd.

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Bahay> Die Bonder
  • MDSY-ZQ6076 Wafer Level Ball Mounter
  • MDSY-ZQ6076 Wafer Level Ball Mounter
  • MDSY-ZQ6076 Wafer Level Ball Mounter
  • MDSY-ZQ6076 Wafer Level Ball Mounter
  • MDSY-ZQ6076 Wafer Level Ball Mounter
  • MDSY-ZQ6076 Wafer Level Ball Mounter
  • MDSY-ZQ6076 Wafer Level Ball Mounter
  • MDSY-ZQ6076 Wafer Level Ball Mounter
  • MDSY-ZQ6076 Wafer Level Ball Mounter
  • MDSY-ZQ6076 Wafer Level Ball Mounter
  • MDSY-ZQ6076 Wafer Level Ball Mounter
  • MDSY-ZQ6076 Wafer Level Ball Mounter

MDSY-ZQ6076 Wafer Level Ball Mounter

Paglalarawan ng Produkto
MDSY-ZQ6076 Wafer Level Ball Mounter details

Wafer level ball mounter MDSY-ZQ6076

1. Apikable na wafer: 12’’ wafer & 8’’ wafer
2. Sukat ng bola: ф60[um]~ ф760 [um]、ф30 [um] sa antas ng lab test
3. Wafer Bump:
a). Pinakamaliit na bilang ng bump pitch: 100 [um]
b). Pinakamaliit na sukat ng bump pad: 85 [um]
c). Max. Bump count: 2.2KK [pins]
*Ang datos ay nakadepende sa mga kondisyon ng device
4. 12” Wafer kaso:
a). Min. Kapaligiran: 200[μm]、100[μm] sa antas ng laboratorio test
b). Max Warpage Tolerance:6 [mm]/concave kaso、3 [mm]/convex kaso
5. Kakaibang kakayahan ng Ball
a). Katatagan sa pag-print ng Flux
Sa taas na ф75[um] Ball: +25[um]
Mas mababa sa ф75[μm] Ball: +1/3 ng diyametro ng ball
b). Katatagan sa pagkakabit ng Ball
Sa-dakó ng ф75[um] Bola::±25[um]
Mas mababa sa ф75[μm] Ball: +1/3 ng diyametro ng ball
Para sa espesyal na kaso, maaaring makamit: +13μm
c). Ratio ng Pagkakamali sa Pagsasa-aklat ng Bola: Mas mababa sa 30 [ppm]
MDSY-ZQ6076 Wafer Level Ball Mounter factory
MDSY-ZQ6076 Wafer Level Ball Mounter details
MDSY-ZQ6076 Wafer Level Ball Mounter factory
MDSY-ZQ6076 Wafer Level Ball Mounter manufacture
MDSY-ZQ6076 Wafer Level Ball Mounter supplier
MDSY-ZQ6076 Wafer Level Ball Mounter factory
MDSY-ZQ6076 Wafer Level Ball Mounter factory
MDSY-ZQ6076 Wafer Level Ball Mounter manufacture
MDSY-ZQ6076 Wafer Level Ball Mounter details
MDSY-ZQ6076 Wafer Level Ball Mounter manufacture
Espesipikasyon
Laki ng Wafer
8, 12 pulgadas na wafer
Laki ng bola
φ60um~Φ760um
Pinakamaliit na layo ng bola
100um(Φ60um bola)
Katumpakan Ng Pag-align
±25um
Sukat
3,595W x1,685D x1,650H [mm]
Timbang
2,600[kg]
Naglo-load, Nag-uunload
Bukas na Kaset, FOSB, FOUP
Pakete & Paghahatod
MDSY-ZQ6076 Wafer Level Ball Mounter details
Company Profile
Mayroon kaming 16 taong karanasan sa pagbebenta ng makinarya. Maaari naming ibigay sa iyo ang One-stop Semiconductor Front-end at Back end Package Line equipments na solusyon mula sa Tsina.
MDSY-ZQ6076 Wafer Level Ball Mounter details
MDSY-ZQ6076 Wafer Level Ball Mounter supplier
MDSY-ZQ6076 Wafer Level Ball Mounter factory
MDSY-ZQ6076 Wafer Level Ball Mounter details
MDSY-ZQ6076 Wafer Level Ball Mounter details

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