The IC packaging is an essential thing of all the electronic devices which we use in our everyday life. What is an IC? An IC stands for Integrated Circuit. This means many small electronic parts are all crammed onto one very tiny chip. This tiny chip is essential for a device to function as it should. The packaging houses the chip and its various components, ensuring they are kept safe. Without that packaging, the chip would have broken or shorted out long before you ever got a chance to plug it into your device. That is the reason why IC packaging exists in electronics!
Well, IC packaging is like a small container that encases the Integrated Circuit chip. The packages are in various shapes and dimensions, That can vary depending on the requirements of each individual device. Think of it as a puzzle piece – just like two pieces from different jigsaw puzzles could not possibly fit together, the IC package must be manufactured precisely to allow perfect fitting into its destination housing. The packaging also fulfills another critical role: it secures the chip from external threats like dust, water, temperature filled up till brim etc. This is to protect the chip or else it can damage easily.
IC packaging is constantly being improved on by researchers and engineers, striving to make it better than what has been created before. They are looking to make packages that will not only protect the chip but, also help in better functioning of the overall device. A more recent idea is to reduce the size and scale of IC packaging. Smaller packaging means the devices themselves are smaller too! This is especially cool because it would allow us to make smaller and more portable devices. The trend for making the packaging ultra tough is another important one. Good packaging can let you drop or knock the device about without it breaking.
A package type is very important to select for each electronic device out of several kinds available in IC packaging. The dimensions of packages can range from that of a very small, thin package to the size and thickness more typical large packets. Some packages are meant for devices that require high power level to function properly, such as computers. Others are designed for lower-power devices like smartphones that consume less power. Manufacturers of them have to take into account several factors when designing it, from the cost and quality of packaging it in (if any),to how well does perform under actual use?
Think about a mobile phone that suddenly no longer works after the first month. Ugh this must be so frustrating! Good IC packaging important to ensure long-life operation of products This ensures that the device will continue to work fine for a long time with no issues. This can help ensure their devices will last a decade or more without failing, when companies pick the right IC package and apply it properly.
Dual in-line package (DIP)– This packaging contains two vertical lines of metal pins projecting from perpendicular side. It's old, has been there for a long time before most other tools and is simple to use. The only downside is that it is generally not recommended for high-power devices as its heat capacity isn't very high.
Ball grid array (BGA): This style of package replaces the tiny legs found on typical ICs with little metal balls under it. This is ideal for high-power devices as it can handle a lot of heat, before breaking. However this type can also be more expensive to produce companies have to weigh these types of factors.
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