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Wafer cutting

Slicing through wafers is difficult and requires a lot of skill to get it perfect. Wafer cutters — these are the people who will slice up your wafers. They will use jigs that allow them to easily make straight and uniform cuts. This is very important, because it will determine how well the wafers can be applied in different technologies.

Wafer cutting is by definition the process of taking a large piece of material, known as a wafer and separating them into smaller pieces. Wafers refer to the thin slices of materials that are widely used in numerous devices (e.g., electronics, solar panels etc.) It is crucial to do the wafer cutting properly in order that no quantity of material goes mismanaged. It should be done perfectly or else it will become a scrap which is why wafer cutting is known as core skill in various industries.

How to cut wafers with surgical precision

The cuts themselves are made using a tool called the diamond saw, which wafer cutters use. It is done so to saw the wafer without damaging it and with a smooth edge, for this special design of diamond saw has been used. Here, the sharp edge is important to allow small electronic parts that have to be in very tight configuration.

All of the pieces should be cut in an equal shape and size. Irregular cutting of the pieces can give rise to trouble in electronics where these are going to be used. For instance, if one component is bigger than the other then it may not perfectly fit in the electronic device and this can cause a problem to perform well. That is why they are putting a great effort to ensure better precision in the cuts made by wafer cutters.

Why choose Minder-Hightech Wafer cutting?

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