The widespread application of plasma cleaning machines in the semiconductor industry

The application of plasma cleaning machines in the semiconductor industry is very extensive, mainly reflected in the following aspects:

▘Surface activation cleaning: For surface activation cleaning of wafers, IC chips, semiconductor silicon wafers, etc., plasma cleaning technology has the function of removing oxide films, organic substances, masks, etc. from the wafer surface, purifying treatment and surface activation, and avoiding virtual soldering phenomenon.

▘Post packaging processing: After the chip packaging is completed, the packaging material is cleaned to remove welding residues and contaminants generated during the packaging process, ensuring product quality. Plasma cleaning machines can achieve pollution-free treatment while avoiding the use of harmful solvents that can harm human health.

▘Removing photoresist residue: Used in the photolithography process of semiconductor manufacturing to define the pattern of equipment. After lithography is completed, the plasma cleaning machine can quickly and thoroughly remove photoresist residue to ensure the accuracy of the pattern and the reliability of the equipment.

▘Pre treatment of film deposition: During the film deposition process, the surface must be kept highly clean to ensure the adhesion and uniformity of the film. Plasma cleaning can effectively remove pollutants and residues before deposition, thereby improving the quality of thin films.

▘Surface modification: Plasma treatment is not only used for cleaning, but can also achieve surface modification. By adjusting the gas composition and processing parameters, plasma technology can improve the hydrophilicity or hydrophobicity of materials, enhance the performance and stability of devices.

▘ Improve adhesion: Plasma cleaning machines can be used to clean packaging materials, such as plastics, ceramics, etc., to enhance the adhesion and reliability of packaging materials; Improve the adhesion performance between grain and pad conductive adhesive, solder paste infiltration performance, enhance the bonding tension of leads, and improve the reliability of packaged devices.