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What is the purpose of a Rapid Thermal Processing(RTP)system in wafer manufacturing process?

Time : 2024-10-15

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RTP uses halogen infrared lamps as a heat source to rapidly heat up the material to the desired temperature, thereby improving the crystal structure and optoelectronic properties of the material.

Its features include high efficiency, energy saving, high degree of automation and uniform heating.

In addition, RTP also has high temperature control accuracy and temperature uniformity, which can meet the needs of various complex processes.

In addition, RTP adopts advanced microcomputer control system and PID closed-loop temperature control technology, It has high temperature control accuracy and temperature uniformity, and can meet the needs of various complex processes.

By using efficient heat sources such as halogen infrared lamps to rapidly heat up the wafer to a predetermined temperature, some defects inside the wafer can be eliminated, and its crystal structure and optoelectronic performance can be improved.

This high-precision temperature control is very important to the quality of the wafer and can effectively improve the performance and reliability of the wafer.

In the process of wafer fabrication, the application of RTP includes but is not limited to the following aspects:

1. Crystal structure optimization:

High temperature helps to rearrange the crystal structure, eliminate crystal structure defects, improve the orderliness of crystal, and thus improve the electronic conductivity of semiconductor materials.

2. Impurity removal:

RTP can promote the diffusion of impurities from semiconductor crystals, reducing the concentration of impurities. This helps to improve the electronic properties of semiconductor devices and reduce energy levels or electron scattering caused by impurities.

3. In CMOS technology, RTP can be used to remove substrate materials such as silicon oxide or silicon nitride to form ultra-thin SOI (insulator on silicon) devices.

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RTP is a key equipment in the semiconductor manufacturing process, characterized by high precision, high efficiency, and high flexibility. It is of great significance for improving wafer performance and promoting the development of the semiconductor industry.

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